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SensorMicro's product portfolio covers both cooled and uncooled infrared technologies, encompassing detectors, modules, and camera cores as the three core product categories.
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View All Thermal lmaging Models in One Place
Wavelength
LWIR
MWIR
Materials
MCT
T2SL
VOx
Resolution
120×90
256×192
330×256
384×288
400×300
640×512
1024×768
1280×1024
2560×2048
Format
Infrared Detector
Infrared Module
Infrared Camera Core
  • Pixel Size: 12μm

  • Energy Efficient:<150mW

  • Cost-effective


  • High Detection Sensitivity, Typical NETD < 30mK

  • Energy Efficient:<180mW

  • Lightweight Structure


  • Pixel Size: 12μm

  • Power Consumption:<150mW

  • Lightweight Structure

  • 1280×1024 HD Resolution

  • Pixel Size: 12μm

  • Typical NETD<35mK

  • Wafer-Level Packaging

  • Pixel Size: 12μm

  • Cost-Effective Integration

  • Wafer-Level Packaging

  • SWaP³

  • Cost-Effective Integration

  • Pixel Size: 12μm

  • Wafer-Level Packaging

  • Cost-Effective Integration

  • 1280×1024/12μm 

  • SWaP³ Optimization

  • Wafer-Level Packaging

  • Wide Spectral Range

  • High Sensitivity

  • Customizable Configurations

  • Sharp Image Quality

  • Multiple Crycooler Options

  • High Sensitivity

  • Sharp Image Quality

  • Excellent signal-to-noise ratio

  • High Sensitivity

  • 1280×1024/7.5μm

  • Easy System Integration

  • High Versatility

  • 1280×1024/10μm

  • Sharp Image Quality

  • Customizable F-number

  • Multiple Crycooler Options

  • Sharp Image Quality

  • Long Detection Range

  • 1280×1024/15μm

  • Sharp Image Quality

  • Plug-and-play

  • Long-Wave Detection

  • T2SL Technology

  • Immune to Interference

  • Long-Wave Detection

  • T2SL Technology

  • High Sensitivity

  • 1280×1024/10μm

  • Long-Wave Detection

  • T2SL Technology

  • Advanced HOT Technology

  • MTTF ≥ 25,000 h

  • SWaP

  • Advanced HOT Technology

  • MTTF up to 25,000 Hours

  • SWaP

  • Advanced HOT Technology

  • 1280×1024/7.5μm

  • MTTF up to 25,000 Hours

  • Advanced HOT Technology

  • 1280×1024/10μm

  • MTTF up to 25,000 Hours

  • 2560×2048/10μm

  • Advanced HOT Technology

  • SWaP

  • Multi-Gas Leak Detection

  • Advanced HOT Technology

  • SWaP³

  • VOCs Leak Detection

  • Multi-Scenario Adaptability

  • Linear Cryocooler

  • Excellent Flame Penetration Capability

  • Multi-Platform, Wide Compatibility

  • High Sensitivity

  • CO₂ Leak Detection

  • MTTF≥10,000h

  • Flexible Platform

  • Designed for CO Leak

  • MTTF ≥ 10,000h

  • Rich Interfaces, Easy Integration

  • LWIR, Focused on SF₆ / NH₃

  • High Sensitivity

  • MTTF ≥ 8,000 h

  • Wafer-Level Packaging

  • Cost-Effective Design

  • Flexible Extension, Rapid Integration

  • Pixel Size: 12μm

  • Unmatched Image Quality

  • Easy-to-integrate

  • 1280×1024/12μm 

  • Outstanding Images, Precise Detection

  • Wafer-Level Packaging

  • Real-time Temperature Measurement

  • Wafer-Level Packaging

  • Comprehensive Functionality, Cost-Effective Design

  • Pixel Size: 12μm

  • Real-time Temperature Measurement

  • Easy-to-integrate

  • 1280×1024/12μm 

  • Monitoring Tiny Temperature Variations

  • Wafer-Level Packaging

  • Shutterless

  • 384×288/12μm

  • Flexible for Integration

  • Shutterless

  • Smooth, Stable

  • Rich Features for Seamless Integration

  • 1280×1024/12μm 

  • Shutterless Design

  • Feature-Rich, Integration-Friendly

  • Medical Diagnosis

  • Non-contact Biological Temperature

  • Easy Integration

  • Too Light to Feel

  • Temperature Measurement

  • Easy Development, Seamless Integration


  • Too Light to Feel

  • SWaP

  • Easy Development, Seamless Integration

  • 256×192/12μm

  • Optimized SWaP Design

  • Cost-Effective

  • SWaP

  • Cost-Effective

  • Easy Integration

  • SWaP

  • Cost-Effective

  • Easy Integration

  • 2.5–4.8μm Spectral Coverage

  • High Sensitivity

  • Easy Integration

  • High Sensitivity

  • Easy Integration

  • Next-generation Image Algorithms

  • High Sensitivity

  • Easy Integration

  • Next-generation Image Algorithms

  • High Sensitivity

  • Exceptional Image Quality

  • Easy Integration


  • 1280×1024/10μm

  • Superior Sensitivity

  • Easy Integration


  • 1280×1024/12μm

  • Superior Sensitivity

  • Easy Integration


  • Cutting-edge HOT Technology

  • SWaP Optimization

  • Easy Integration

  • Cutting-edge HOT Technology

  • SWaP Optimization

  • Pixel Size: 10μm


  • 1280×1024/7.5μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • 1280×1024/10μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • LWIR with Resilience Against Interference

  • T2SL

  • Rich Interfaces, Easy Integration


  • LWIR with Resilience Against Interference

  • T2SL

  • Rich Interfaces, Easy Integration


  • 1280×1024/10μm

  • LWIR with Resilience Against Interference

  • Rich Interfaces, Easy Integration


  • Multi-Gas Leak Detection

  • Advanced HOT Technology

  • SWaP³

  • Identification of Common VOCs Leaks

  • Easy Integration

  • High Sensitivity

  • Excellent Flame Penetration Capability

  • Multi-Platform, Wide Compatibility

  • Smart Algorithms

  • CO₂ Leak Detection

  • High Sensitivity

  • Rich Interfaces, Easy Integration

  • Designed for CO Leak

  • High Sensitivity

  • Rich Interfaces, Easy Integration

  • LWIR, Focused on SF₆ / NH₃

  • High Sensitivity

  • Rich Interfaces, Easy Integration

  • 120×90/12μm

  • Ultimate SWaP-C Optimization

  • Integration into Miniature Devices

  • 256×192/12μm

  • Ultimate SWaP-C Optimization

  • Wafer-Level Packaging

  • 256×192/12μm

  • Rich Interfaces and Lens Options

  • Wafer-Level Packaging

  • 120×90/12μm

  • Applied to Mobile Terminal Devices

  • Wafer-Level Packaging

  • 256×192/12μm

  • Applied to Mobile Terminal Devices

  • Wafer-Level Packaging

  • Designed for Integrators

  • Adjustable High Frame Rate

  • Mass Production Ready

  • Designed for Integrators

  • Adjustable High Frame Rate

  • Mass Production Ready

  • Designed for Integrators

  • Adjustable High Frame Rate

  • Linear Cryocooler

  • 1280×1024/12μm

  • Designed for Integrators

  • Mass Production Ready

  • Cutting-edge HOT Technology

  • Easy Integration

  • SWaP

  • Cutting-edge HOT Technology

  • Easy Integration

  • Large Format, Small Pixel

  • 1280×1024/10μm

  • Cutting-edge HOT Technology

  • Easy Integration

  • LWIR for Anti-Interference Detection

  • T2SL

  • Adjustable high frame rate

  • 1280×1024/10μm

  • LWIR

  • Easy Integration

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