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Super412W LWIR 400×30012μm VOx Uncooled Infrared Thermal Detector
Super412W LWIR 400×30012μm VOx Uncooled Infrared Thermal Detector

Apex412W
LWIR 400×300/12μm VOx Uncooled Infrared Thermal Detector

The Super412W uncooled infrared detector is specifically designed for consumer-grade infrared applications and large-scale adoption. Featuring wafer-level packaging technology, it offers significant advantages in compact size, lightweight design, and ultra-low power consumption. This makes it an ideal integrated infrared solution for scaling thermal imaging technology across a wide range of applications, from consumer electronics to industrial infrared imaging systems.

Main Features

Wafer-Level Packaging for Cost-Effective Integration
Wafer-Level Packaging for Cost-Effective Integration
  • Compact size and lightweight design for easy integration into space-constrained devices

  • Low-power operation supports extended runtime for portable devices

  • Optimized for mass production and cost efficiency, ideal for large-scale applications


Energy-saving for Longer Battery Life
Energy-saving for Longer Battery Life
  • Power consumption: <110mW

  • Prolongs device battery life, adaptable to a wide range of application scenarios


High Sensitivity, Outstanding Performance
High Sensitivity, Outstanding Performance
  • High detection sensitivity with typical NETD<40mK

  • Delivers clear imaging and accurate temperature measurement

Specifications

ModelSuper412W
Sensitive MaterialVOx
PackageWafer-Level
Resolution400×300
Pixel Size12μm
Spectral Response8μm~14μm
NETD﹤40mK
Output SignalBuilt-in 14 bits ADC
Thermal Response Time﹤12ms
Max. Frame Rate50Hz
Power Consumption﹤110mW
Size(mm)17.3×17.3
Weight(g)﹤2
Operating Temperature-40℃ ~ +85℃


Applications

Learn More >>
Bellows Hotspot Detection
Bellows Hotspot Detection
Electrical Cabinet Thermal Scan
Electrical Cabinet Thermal Scan
Molten Iron Temperature Check
Molten Iron Temperature Check
Power Line Fault Detection
Power Line Fault Detection
  • Pixel Size: 12μm

  • Energy Efficient:<150mW

  • Cost-effective


  • Wafer-Level Packaging

  • SWaP³

  • Cost-Effective Integration

  • Pixel Size: 12μm

  • Wafer-Level Packaging

  • Cost-Effective Integration

  • High Detection Sensitivity, Typical NETD < 30mK

  • Energy Efficient:<180mW

  • Lightweight Structure


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