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Super612C LWIR640×512 12μm VOx Uncooled Infrared Thermal Detector
Super612C LWIR640×512 12μm VOx Uncooled Infrared Thermal Detector

Apex612C
LWIR 640×512/12μm VOx Uncooled Infrared Thermal Detector

The ceramic-packaging Super612C uncooled infrared detector features mainstream resolution that offers superb clarity. The detector is a combination of high performance, low power consumption, compact size, lightweight structure, and excellent reliability, offering a strong balance between detection sensitivity and overall performance. The lightweight design of core components enables more compact and efficient thermal imaging modules, delivering a high-quality, cost-effective infrared solution for a wide range of detection and temperature measurement applications.

Main Features

Ceramic Packaging, High Cost Performance
Ceramic Packaging, High Cost Performance
  • TEC-free operation for compact and lightweight experience

  • High sensitivity for clear imaging, excellent value for money


Sensitive Detection, Excellent Performance
Sensitive Detection, Excellent Performance
  • High detection sensitivity, typical NETD<30mK

  • High-definition and smooth imaging with frame rates up to 50Hz


Energy Efficient, Long-Lasting Operation
Energy Efficient, Long-Lasting Operation
  • Power consumption: <150mW

  • Extends device battery life, suitable for a wide range of applications


Specifications

ModelSuper612C
Sensitive MaterialVOx
PackageCeramic
Resolution640×512
Pixel Size12μm
Spectral Response8μm~14μm
NETD﹤35mK
Output SignalBuilt-in 14 bits ADC
Thermal Response Time﹤12ms
Max. Frame Rate50Hz
Power Consumption﹤150mW
Size(mm)18.5×18.5×3.78
Weight(g)﹤4.5
Operating Temperature-40℃ ~ +85℃


Applications

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Bellows Hotspot Detection
Bellows Hotspot Detection
Electrical Cabinet Thermal Scan
Electrical Cabinet Thermal Scan
Molten Iron Temperature Check
Molten Iron Temperature Check
Power Line Fault Detection
Power Line Fault Detection
  • Pixel Size: 12μm

  • Energy Efficient:<150mW

  • Cost-effective


  • Pixel Size: 12μm

  • Wafer-Level Packaging

  • Cost-Effective Integration

  • High Detection Sensitivity, Typical NETD < 30mK

  • Energy Efficient:<180mW

  • Lightweight Structure


  • 1280×1024 HD Resolution

  • Pixel Size: 12μm

  • Typical NETD<35mK

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