Email Us
Super612W LWIR 640×51212μm VOx Uncooled Infrared Thermal Detector
Super612W LWIR 640×51212μm VOx Uncooled Infrared Thermal Detector

Apex612W
LWIR 640×512/12μm VOx Uncooled Infrared Thermal Detector

Featuring wafer-level packaging technology, the Super612W uncooled infrared detector boasts significant advantages in compact size, lightweight design, and ultra-low power consumption. With a mainstream focal plane array, it delivers clear and precise thermal detection. This makes it an ideal integrated infrared solution for scaling thermal imaging applications across a wide range—from household to professional-grade use.

Main Features

Wafer-Level Packaging for Cost-Effective Integration
Wafer-Level Packaging for Cost-Effective Integration
  • Compact size and lightweight design for easy integration into space-constrained devices

  • Low-power operation supports extended runtime for portable devices

  • Optimized for mass production and cost efficiency, ideal for large-scale applications

Energy-saving for Longer Battery Life
Energy-saving for Longer Battery Life
  • Power consumption: <150mW

  • Prolongs device battery life, adaptable to a wide range of application scenarios


High Sensitivity, Outstanding Performance
High Sensitivity, Outstanding Performance
  • Typical NETD<40mK

  • Delivers clear imaging and accurate temperature measurement

Specifications

ModelSuper612W
Sensitive MaterialVOx
PackageWafer-Level
Resolution640×512
Pixel Size12μm
Spectral Response8μm~14μm
NETD﹤40mK
Output SignalBuilt-in 14 bits ADC
Thermal Response Time﹤12ms
Max. Frame Rate50Hz
Power Consumption﹤150mW
Size(mm)17.3×17.3
Weight(g)<2.5g
Operating Temperature-40℃ ~ +85℃


Applications

Learn More >>
Bellows Hotspot Detection
Bellows Hotspot Detection
Electrical Cabinet Thermal Scan
Electrical Cabinet Thermal Scan
Molten Iron Temperature Check
Molten Iron Temperature Check
power line fault detection
power line fault detection
  • Wafer-Level Packaging

  • Pixel Size: 12μm

  • Cost-Effective Integration

  • Pixel Size: 12μm

  • Power Consumption:<150mW

  • Lightweight Structure

  • Wafer-Level Packaging

  • SWaP³

  • Cost-Effective Integration

  • High Detection Sensitivity, Typical NETD < 30mK

  • Energy Efficient:<180mW

  • Lightweight Structure


Reach Our Experts
Ready to find the right thermal imaging solution?
We use cookies to offer you a better browsing experience, analyze site traffic and personalize content. Part of the tracking is necessary to ensure SEO effectiveness,
By using this site, you agree to our use of cookies. Visit our cookie policy to learn more.
Reject Accept