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COIN1212R LWIR 1280×1024 12μm Uncooled Infrared Thermal Core
COIN1212R LWIR 1280×1024 12μm Uncooled Infrared Thermal Core

COIN1212R
LWIR 1280×1024/12μm Uncooled Infrared Thermal Core

The COIN1212R infrared camera core features a megapixel 1280×1024/12μm wafer-level infrared detector, integrated with advanced signal processing circuits and temperature measurement algorithms. It supports mainstream serial communication protocols and offers a variety of video output interfaces along with a full range of optical lens options. Capable of quickly detecting temperature differences and delivering clear thermal images and precise temperature data, it significantly streamlines secondary development of temperature measurement systems. This makes it an all-in-one thermal imaging integration solution for applications in intelligent monitoring, high-end manufacturing, process control, scientific research, and other high-end thermal imaging applications.

Main Features

High-Definition Imaging, Precise Detection
High-Definition Imaging, Precise Detection
  • Megapixel high-definition detection enables infrared temperature measurement over wider views and larger areas

  • When monitoring tiny temperature variations, more thermal details of the target are clearly revealed

Full-Featured and Efficient
Full-Featured and Efficient
  • Developed with a top-tier large-format wafer-level infrared detector

  • Integrated with multiple advanced image processing algorithms to enhance image quality

  • Temperature measurement accuracy up to ±3°C or ±3%, supporting -20°C to 150°C and 0 to 550°C ranges, with customizable extensions

Multiple Configurations, Rapid Integration
Multiple Configurations, Rapid Integration
  • Supports various image output modes including DVP and BT.1120

  • RAW/YUV image data output with serial port control

Specifications

ModelCOIN1212R
IR Detectors Indicators
Sensitive MaterialVOx
Resolution1280×1024
Pixel Size12μm
Spectral Response8μm ~ 14μm
Typical NETD≤40mK/F1.0/25℃
Image Processing
Digital Frame Rate25/30Hz
Start-up Time6s
Analog Video/
Digital VideoDVP16/BT.1120
Image AlgorithmNon-uniformity Correction (NUC)
3D Noise Reduction (3DNR)
2D Noise Suppression (DNS)
Dynamic Range Compression (DRC)
Edge Enhancement (EE)
Image Display10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot)
PC Software
ICC SoftwareModule Control & Video Display
Electrical
Standard External Interface50pin: DF40C-50DP-0.4V(51), (HRS,Male)
Extension BoardUSB3.0
Communication InterfaceTTL-232
Digital Video InterfaceDVP16/ BT.1120
Supply Voltage4.5~5.5V
Typical Power Consumption0.95W
Temperature Measurement
Operating Temperature-10℃~+50℃
Temperature Measurement Range-20℃~150℃, 0℃~550℃; Support Customization and Expansion
Temperature Measurement AccuracyGreater of ±2℃ / ±2%
Partial Temperature MeasurementSupport output maximum, minimum and average value of temperature measurement areas
SDKAndroid/Windows/Linux; Achieve Video Stream Analysis and Conversion from Gray to Temperature
Mechanical
Bare Core Size(mm)25.4×25.4×19.3
Bare Core Weight(g)14±2
Environmental Adaptability
Operating Temperature-40℃~+70℃
Storage Temperature-45℃~+85℃
Humidity5%~95%, non-condensing
VibrationSine Vibration, Frequency: 10HZ~150HZ~10HZ, Peak Value: 0.15mm, Axial Direction: X, Endurance Time: 8min/axis, Cycles: 2 times
ImpactHalf Sine Wave, 30g/11ms, Impact Direction X Axis, 3 times
CertificationROHS2.0/REACH
Optical Lens
Optical LensFixed Focus Athermal: 14mm/19mm/24mm/35mm
Protection LevelIP67(Front Lens)


Applications

Learn More >>
Bellows Hotspot Detection
Bellows Hotspot Detection
Electrical Cabinet Thermal Scan
Electrical Cabinet Thermal Scan
Molten Iron Temperature Check
Molten Iron Temperature Check
Power Line Fault Detection
Power Line Fault Detection
  • 1280×1024/12μm 

  • Shutterless Design

  • Feature-Rich, Integration-Friendly

  • SWaP

  • Cost-Effective

  • Easy Integration

  • Pixel Size: 12μm

  • Real-time Temperature Measurement

  • Easy-to-integrate

  • 1280×1024/12μm 

  • Outstanding Images, Precise Detection

  • Wafer-Level Packaging

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