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COIN612RG² LWIR 640×512 12μm Uncooled Infrared Thermal Core
COIN612RG² LWIR 640×512 12μm Uncooled Infrared Thermal Core

COIN612RG2
LWIR 640×512/12μm Uncooled Infrared Thermal Core

The COIN612RG² infrared camera core for temperature measurement features a 640×512 wafer-level infrared detector in a compact, low-power design. With advanced signal processing and temperature measurement algorithms, it delivers real-time temperature detection with an accuracy of ±3°C or ±3%. Fully compatible with standard serial communication protocols, COIN612RG² supports multiple video output interfaces and a complete range of optical lenses, streamlining secondary development. It provides a comprehensive infrared temperature measurement solution for industrial thermography, process control, and intelligent manufacturing, enabling users to efficiently complete secondary development and system integration—from hardware to algorithms.

Main Features

Comprehensive Functionality, Cost-Effective Design
Comprehensive Functionality, Cost-Effective Design
  • Developed using a high-performance, cost-efficient wafer-level infrared detector

  • Combines a mainstream FPA with advanced image processing algorithms for enhanced image quality

  • Temperature measurement accuracy up to ±2°C or ±2%, supporting ranges of -20°C to 150°C and 100℃ to 550°C, with customizable extensions


Compact and Lightweight, High Efficiency with Low Power
Compact and Lightweight, High Efficiency with Low Power
  • Dimensions: 25.4×25.4×15.7mm

  • Weight: 15±1g, Power consumption: ≤0.7W

Multiple Configurations, Rapid Integration
Multiple Configurations, Rapid Integration
  • Optional optical lenses to meet diverse application requirements

  • Supports USB2.0/DVP/LVDS/BT.656 image output interfaces

  • RAW/YUV/TMP image data output with serial port control

Specifications

ModelCOIN612RG2
IR Detectors Indicators
Sensitive MaterialVOx
Resolution640×512
Pixel Size12μm
Spectral Response8μm ~ 14μm
Typical NETD≤30mK/F1.0/25℃
Image Processing
Digital Frame Rate25/30Hz
Start-up Time6s
Analog VideoPAL/NTSC
Digital VideoRAW/YUV422/TMP
Image AlgorithmNon-uniformity Correction (NUC)
3D Noise Reduction (3DNR)
2D Noise Suppression (DNS)
Dynamic Range Compression (DRC)
Edge Enhancement (EE)
Image Display10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot)
PC Software
ICC SoftwareModule Control & Video Display
Electrical
Standard External Interface50pin: DF40C-50DP-0.4V(51), (HRS,Male)
USB Expansion BoardUSB3.0/USB2.0/VPC/USB2.0&VPC
Communication InterfaceTTL-232/USB2.0
Digital Video InterfaceDVP8/DVP16/USB2.0/BT.656/LVDS
Supply Voltage4.5~5.5V
Typical Power Consumption0.7W
Temperature Measurement
Operating Temperature-10℃~+50℃
Temperature Measurement Range-20℃~150℃, 100℃~550℃; Support Customization and Expansion
Temperature Measurement Accuracy≤25mm Lens: ±2°C or ±2% (whichever is greater)
35mm Lens: ±5°C or ±5% (whichever is greater)
Partial Temperature MeasurementSupport output maximum, minimum and average value of temperature measurement areas
SDKAndroid/Windows/Linux; Achieve Video Stream Analysis and Conversion from Gray to Temperature
Mechanical
Bare Core Size(mm)25.4×25.4×15.7mm
Bare Core Weight(g)15±1g
Environmental Adaptability
Operating Temperature-40℃~+70℃
Storage Temperature-45℃~+85℃
Humidity5%~95%, non-condensing
Vibration5.35grms, Random Vibration, 3-axis
ImpactHalf Sine Wave, 30g/11ms, Impact Direction X Axis, 3 times
CertificationROHS2.0/REACH
Optical Lens
Optical LensFixed Focus Athermal: 4.8mm/7mm/9.1mm/13mm/19mm/25m/35mm
Protection LevelIP67(Front Lens)


Applications

Learn More >>
Bellows Hotspot Detection
Bellows Hotspot Detection
Electrical Cabinet Thermal Scan
Electrical Cabinet Thermal Scan
Molten Iron Temperature Check
Molten Iron Temperature Check
Power Line Fault Detection
Power Line Fault Detection
  • Wafer-Level Packaging

  • Cost-Effective Design

  • Flexible Extension, Rapid Integration

  • SWaP

  • Cost-Effective

  • Easy Integration

  • Pixel Size: 12μm

  • Unmatched Image Quality

  • Easy-to-integrate

  • 1280×1024/12μm 

  • Outstanding Images, Precise Detection

  • Wafer-Level Packaging

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