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Cooled infrared A/D modules act as accelerators for thermal imaging camera core development, offering an integrated analog-to-digital conversion solution. By simplifying signal processing and calibration, they significantly reduce development cycles and help engineers bring infrared systems to market faster.
Designed with flexibility in mind, the modules support various focal plane array (FPA) formats, enabling easy adaptation to different detector specifications and application requirements—from research to industrial and defense-grade systems.
With continuously adjustable frame rates (1–200 Hz), the modules deliver optimal imaging performance across dynamic environments. Their high-speed response enables accurate capture of fast-moving or transient thermal events in real time.
Engineered for ease of use, the modules provide plug-and-play integration, reducing hardware complexity and software effort. Developers can focus on system innovation rather than low-level interfacing—making thermal imaging integration simpler, faster, and smarter.
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