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GAVIN GC1010HMG HOT MWIR 1024×768 10μm T2SL Cooled Infrared Camera Core
GAVIN GC1010HMG HOT MWIR 1024×768 10μm T2SL Cooled Infrared Camera Core

GAVIN GC1010HMG
HOT MWIR 1024×768/10μm T2SL Cooled Infrared Camera Core

The GAVIN GC1010HMG infrared camera core integrates a 1024×768/10μm HOT MWIR cooled infrared detector, offering a larger array and smaller pixels compared to the GAVIN GC615HMG, resulting in clearer imaging with finer details. Combined with next-generation image processing algorithms, it delivers stable, high-quality images, while HOT technology enables next-level SWaP optimizations with smaller and lighter design, and low power consumption. The easy-to-integrate infrared camera core supports various digital video interfaces, making it ideal for handheld devices, mobile payloads, and long-duration monitoring in compact integration scenarios where size, energy efficiency, and long-range detection are critical.

Main Features

Superior Quality with Larger FPA and Smaller Pixel Size
Superior Quality with Larger FPA and Smaller Pixel Size
  • Developed based on a 1024×768/10μm large-format HOT MWIR cooled infrared detector, delivering clear images and wide field of view

  • Equipped with next-generation image processing algorithms including DRC, 2D/3D noise reduction, and EE edge enhancement for superior image quality

  • Smaller 10μm pixel size provides higher spatial resolution and better signal-to-noise ratio

SWaP Optimization Leading by HOT Technology
SWaP Optimization Leading by HOT Technology
  • Supports 150K high-temperature operation, with cooling time ≤ 4min

  • Compact size: 87×94×54.5mm, lightweight: 460g

Rich Interfaces, Easy Integration
Rich Interfaces, Easy Integration
  • Supports CameraLink/USB3.0/GigE/HDMI/SDI/MIPI/Fiber optic interfaces

  • Flexible RAW/YUV image output


Specifications

ModelGAVIN GC1010HMG HOT MWIR Cooled Infrared Camera Core
Indicators
Resolution1024×768
Pixel Size10μm
Spectral Response3.7μm±0.2μm~4.8μm±0.2μm
IR Detector NETD(23℃)20mK(F2)
25mK(F4)
Image Processing
Frame Rate50Hz
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Analog VideoPAL/NTSC
Digital VideoStandard:DVP/LVDS/USB2.0
Option:Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply12V±1V
Steady Power Consumption(23℃)≤8W
Cooling Time(23℃)≤4min
Size(mm)87×94×54.5
Weight(g)≤460
Operating Temperature-40℃~+71℃
Optical Lens
Lens OptionsFixed focus: 25mm/F2


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • 1280×1024/10μm

  • Superior Sensitivity

  • Easy Integration


  • 1280×1024/7.5μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • 1280×1024/10μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • 1280×1024/10μm

  • LWIR with Resilience Against Interference

  • Rich Interfaces, Easy Integration


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