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7.5μm T2SL Cooled Infrared Camera Core
7.5μm T2SL Cooled Infrared Camera Core

GAVIN GC1207HMG
HOT MWIR 1280×1024/7.5μm T2SL Cooled Infrared Camera Core

The GAVIN GC1207HMG infrared camera core features a 1280×1024/7.5μm High Operating Temperature (HOT) mid-wave infrared (MWIR) cooled detector. Compared to traditional 640×512/15μm MWIR solutions, it offers one-third smaller pixel size and four times higher resolutions, which dramatically enhances spatial resolution and image clarity. Combined with advanced image processing algorithms, it delivers high-definition, detailed infrared imagery at megapixel resolution. With the same field of view, the 7.5μm small pixel design supports shorter focal lengths and more compact optical system designs. Combined with HOT technology, the product demonstrates significant SWaP (Size, Weight, and Power) advantages, making it particularly suitable for applications such as high-precision long-range detection and platforms with limited space.

Main Features

Megapixel Resolution, Ultra-Small Pixel Size
Megapixel Resolution, Ultra-Small Pixel Size
  • 1280×1024 resolution with next-gen image algorithms including DRC, 2D/3D noise reduction, and EE edge enhancement, delivering megapixel thermal images directly

  • With the same FOV, the 7.5μm small pixel size supports shorter focal lengths and more compact optical system designs, enhancing integration flexibility


HOT Technology, Ultimate SWaP Optimization
HOT Technology, Ultimate SWaP Optimization
  • Supports high operating temperature up to 150 K, with cooling time ≤4 min

  • Compact size of only 71×55×84mm and lightweight at 360g


Rich Interfaces, Easy Integration
Rich Interfaces, Easy Integration
  • Multiple image interfaces: CameraLink/USB 3.0/GigE/HDMI/SDI/MIPI/Fiber

  • Flexible output of RAW/YUV image data


Specifications

ModelGAVIN GC1207HMG HOT MWIR Cooled Infrared Camera Core
Indicators
Resolution1280×1024
Pixel Size7.5μm
Spectral Response3.7μm±0.2μm~4.8μm±0.2μm
F/#4
IR Detector NETD(23℃)35mk(F4)
Image Processing
Frame Rate50Hz
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Digital VideoStandard: DVP
Option: Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply12V±1V
Steady Power Consumption(23℃)≤8W
Cooling Time(23℃)≤4min
Size(mm)71×55×84
Weight(g)≤360
Operating Temperature-40℃~+71℃
Optical Lens
Lens OptionsFixed focus: 25mm/F2
Continuous zoom: 15~300mm/F4 23~450mm/F4


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • 1280×1024/10μm

  • Superior Sensitivity

  • Easy Integration


  • Cutting-edge HOT Technology

  • SWaP Optimization

  • Pixel Size: 10μm


  • 1280×1024/10μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • 1280×1024/10μm

  • LWIR with Resilience Against Interference

  • Rich Interfaces, Easy Integration


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