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GAVIN GC1210HMF HOT MWIR 1280×1024 10μm T2SL Cooled Infrared Camera Core
GAVIN GC1210HMF HOT MWIR 1280×1024 10μm T2SL Cooled Infrared Camera Core

GAVIN GC1210HMF
HOT MWIR 1280×1024/10μm T2SL Cooled Infrared Camera Core

The GAVIN GC1210HMF infrared camera core features a 1280×1024/10μm High Operating Temperature (HOT) mid-wave infrared (MWIR) cooled detector. Compared to traditional 640×512/15μm MWIR solutions, it offers one-third smaller pixel pitch and four times higher resolution array, which dramatically enhances spatial resolution and image clarity. Combined with advanced image processing algorithms, it delivers high-definition, finely detailed infrared imagery at megapixel resolution. Powered by HOT technology, the GAVIN GC1210HMF infrared camera core significantly enhances SWaP performance by offering a compact size, lightweight design, and low power consumption, making it an ideal solution for long-range infrared  systems with strict space and integration requirements.

Main Features

Megapixel Imaging, Superior Quality
Megapixel Imaging, Superior Quality
  • Developed based on a 1280×1024/10μm HOT MWIR cooled infrared detector, delivering high-definition and delicate image quality

  • Integrated with advanced image processing algorithms such as DRC, 2D/3D noise reduction, and EE edge enhancement for clearer imaging


HOT Technology for Ultimate SWaP Optimization
HOT Technology for Ultimate SWaP Optimization
  • Supports high-temperature operation at 150K, with a cooling time ≤4min

  • Compact dimensions down to 101×101×54mm, lightweight at just 570g

Rich Interfaces, Easy Integration
Rich Interfaces, Easy Integration
  • Supports Cameralink/USB3.0/GigE/HDMI/SDI/MIPI/fiber optic video outputs

  • Flexible RAW/YUV image data output


Specifications

ModelGAVIN GC1210HMF HOT MWIR Cooled Infrared Camera Core
Indicators
Resolution1280×1024
Pixel Size10μm
Spectral Response3.7μm±0.2μm~4.8μm±0.2μm
IR Detector NETD(23℃)20mK(F2)
25mK(F4)
Image Processing
Frame Rate50Hz
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Digital VideoStandard: DVP
Option: Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply12V±1V
Steady Power Consumption(23℃)≤8W
Cooling Time(23℃)≤4min
Size(mm)101×101×54
Weight(g)≤570
Operating Temperature-40℃~+71℃
Optical Lens
Lens OptionsFixed focus: 15mm/F2
Continuous zoom: 15~300mm/F4  30~500mm/F4


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • 1280×1024/10μm

  • Superior Sensitivity

  • Easy Integration


  • Cutting-edge HOT Technology

  • SWaP Optimization

  • Pixel Size: 10μm


  • 1280×1024/7.5μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • 1280×1024/10μm

  • LWIR with Resilience Against Interference

  • Rich Interfaces, Easy Integration


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