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GAVIN GC1210LC LWIR 1280×1024 10μm T2SL Cooled Infrared Camera Core
GAVIN GC1210LC LWIR 1280×1024 10μm T2SL Cooled Infrared Camera Core

GAVIN GC1210LC
LWIR 1280×1024/10μm T2SL Cooled Infrared Camera Core

The GAVIN GC1210LC infrared camera core adopts a Type-II Superlattice 1280×1024/10μm LWIR cooled infrared detector. Compared with traditional 640×512/15μm long-wave products, it reduces pixel size by one-third and increases resolution by four times, significantly enhancing spatial resolution and image clarity. Combined with multiple image processing algorithms, it delivers high-definition, delicate megapixel infrared images, making it particularly suitable for long-range target detection tasks in poor visibility and harsh weather conditions.

Main Features

Megapixel, High-Definition Imaging
Megapixel, High-Definition Imaging
  • Developed with a 1280×1024/10μm megapixel long-wave detector for exceptional detail

  • Enhanced with next-generation image algorithms including DRC, 2D/3D noise reduction, and EE edge enhancement for clearer imaging


LWIR with Resilience against Interference
LWIR with Resilience against Interference
  • Strong resistance to dust and glare, adaptable to complex environments

  • Capable of detecting low-temperature objects

  • Type-II Superlattice technology with excellent quantum efficiency and uniformity


Rich Interfaces, Easy Integration
Rich Interfaces, Easy Integration
  • Multiple image interfaces: CameraLink/USB 3.0/GigE/HDMI/SDI/MIPI/Fiber

  • Flexible RAW/YUV image data output


Specifications

ModelGAVIN GC1210LC LWIR Cooled Infrared Camera Core
Indicators
Resolution1280×1024
Pixel Size10μm
Spectral Response7.7μm±0.2μm~9.4μm±0.3μm
IR Detector NETD(23℃)35mK(F2)
Image Processing
Frame Rate50Hz
Dimming ModeLinear/Histogram/Mixed
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Digital VideoStandard: DVP
Option: Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply24V±4V
Steady Power Consumption(23℃)≤15W
Cooling Time(23℃)≤8min
Size(mm)148×59×82
Weight(g)≤730
Operating Temperature-40℃~+71℃
Optical Lens
Lens OptionsFixed focus: 45mm/F2
Continuous zoom: 30~300/F2


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • 1280×1024/10μm

  • Superior Sensitivity

  • Easy Integration


  • Cutting-edge HOT Technology

  • SWaP Optimization

  • Pixel Size: 10μm


  • 1280×1024/7.5μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • 1280×1024/10μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


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