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gavin-gc1210ma-cooled-infrared-camera-cores
gavin-gc1210ma-cooled-infrared-camera-cores

GAVIN GC1210MA
MWIR 1280×1024/10μm MCT Cooled Infrared Camera Core

Equipped with a self-developed 1280×1024/10μm MWIR cooled infrared detector, the GAVIN GC1210MA delivers four times the pixel count of conventional 640×512 detectors over the same active imaging area. This enables a significantly wider field of view and reveals finer image details. Enhanced with a suite of advanced image processing algorithms, the camera core outputs clear thermal images directly. Even in complete darkness or harsh weather conditions, it can reliably detect distant potential threats as well as fine details of nearby targets.

Main Features

Megapixel Resolution, Exceptional Image Quality
Megapixel Resolution, Exceptional Image Quality
  • Powered by a 1280×1024/10μm mid-wave cooled infrared detector for sharp, detailed thermal imaging

  • Integrates advanced image processing algorithms including DRC, 2D/3D noise reduction, and edge enhancement (EE) for superior clarity


High Reliability, Superior Sensitivity
High Reliability, Superior Sensitivity
  • MWIR cooled thermal imaging technology ensures excellent adaptability and consistency across applications

  • Outstanding thermal sensitivity with NETD as low as 20mK


Easy Integration, Flexible Configuration
Easy Integration, Flexible Configuration
  • Supports CameraLink interface with RAW/YUV image data output

  • Multiple continuous zoom optical configurations available for different needs


Specifications

ModelGAVIN GC1210MA MWIR Cooled Infrared Camera Core
Indicators
Resolution1280×1024
Pixel Size10μm
Spectral Response3.7μm±0.2μm~4.8μm±0.2μm
IR Detector NETD(23℃)20mK(F2/F4)
Image Processing
Frame Rate50Hz
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Digital VideoStandard: DVP
Option: Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply24V±4V
Steady Power Consumption(23℃)≤14W
Cooling Time(23℃)≤9min
Size(mm)145×61×82
Weight(g)≤680
Operating Temperature-40℃~+71℃
Optical Lens
Lens OptionsFixed focus: 15mm/F2
Continuous zoom: 15~300mm/F4 30~500mm/F4


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • 1280×1024/12μm

  • Superior Sensitivity

  • Easy Integration


  • 1280×1024/7.5μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • 1280×1024/10μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • Cutting-edge HOT Technology

  • SWaP Optimization

  • Pixel Size: 10μm


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