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GAVIN GC1212MA MWIR 1280×1024 12μm MCT Cooled Infrared Camera Core
GAVIN GC1212MA MWIR 1280×1024 12μm MCT Cooled Infrared Camera Core

GAVIN GC1212MA
MWIR 1280×1024/12μm MCT Cooled Infrared Camera Core

The GAVIN GC1212MA HD MWIR cooled infrared camera core features a self-developed 1280×1024/12μm MWIR cooled detector, providing four times the pixel count of a conventional 640×512 detector within the same active image area. This enables a wider field of view and reveals more image details. Equipped with multiple image processing algorithms, it delivers high-definition images directly, suitable for all-weather target detection under various visibility conditions and harsh environments.

Main Features

Megapixel Resolution, Exceptional Image Quality
Megapixel Resolution, Exceptional Image Quality
  • Powered by a 1280×1024/12μm mid-wave cooled infrared detector for sharp, detailed thermal imaging

  • Integrates advanced image processing algorithms including DRC, 2D/3D noise reduction, and edge enhancement (EE) for superior clarity


High Reliability, Superior Sensitivity
High Reliability, Superior Sensitivity
  • Mid-wave cooled thermal imaging technology ensures excellent adaptability and consistency across applications

  • Outstanding thermal sensitivity with NETD as low as 18mK


Easy Integration, Flexible Configuration
Easy Integration, Flexible Configuration
  • Supports CameraLink interface with RAW/YUV image data output

  • Multiple continuous zoom optical configurations available for different needs


Specifications

ModelGAVIN GC1212MA MWIR Cooled Infrared Camera Core
Indicators
Resolution1280×1024
Pixel Size12μm
Spectral Response3.7μm±0.2μm~4.8μm±0.2μm
IR Detector NETD(23℃)18mK(F2/F4)
Image Processing
Frame Rate50Hz
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Digital VideoStandard: DVP
Option: Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply24V±4V
Steady Power Consumption(23℃)≤11W
Cooling Time(23℃)≤8min
Size(mm)149×58.5×80
Weight(g)≤680
Operating Temperature-40℃~+71℃
Optical Lens
Lens OptionsFixed focus: 19mm/F2
Continuous zoom: 60~360mm/F4   37.5~750mm/F4   100~1100mm/F4


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • 1280×1024/10μm

  • Superior Sensitivity

  • Easy Integration


  • 1280×1024/7.5μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • 1280×1024/10μm

  • Cutting-edge HOT Technology

  • SWaP Optimization


  • 1280×1024/10μm

  • LWIR with Resilience Against Interference

  • Rich Interfaces, Easy Integration


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