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GAVIN GC615HMG HOT MWIR 640×512 15μm T2SL Cooled Infrared Camera Core
GAVIN GC615HMG HOT MWIR 640×512 15μm T2SL Cooled Infrared Camera Core

GAVIN GC615HMG
HOT MWIR 640×512/15μm T2SL Cooled Infrared Camera Core

The GAVIN GC615HMG infrared camera core integrates a 640×512/15μm HOT MWIR cooled infrared detector with next-generation image processing algorithms. The HOT technology enables not only high-quality and stable imaging, but also compact size, lightweight design, and low power consumption, delivering optimized SWaP performance for versatile applications. With broad compatibility across multiple digital video interfaces and easy secondary development, it is suitable for handheld devices, mobile payloads, and long-duration monitoring, meeting stringent requirements for compact size, energy efficiency, and long-range detection in various infrared integration scenarios.

Main Features

Mainstream FPA, Clear Imaging
Mainstream FPA, Clear Imaging
  • Developed based on a 640×512/15μm large-format HOT MWIR cooled infrared detector, offering excellent versatility

  • Equipped with next-generation image processing algorithms, including DRC, 2D/3D noise reduction, and edge enhancement (EE), delivering clearer images


HOT Technology Leading SWaP Optimization
HOT Technology Leading SWaP Optimization
  • Supports high-temperature operation up to 150K, with cooling time ≤ 3min30s

  • Compact size: 71×55×84 mm, weight: 350g, power consumption: 7W


Rich Interfaces, Easy Integration
Rich Interfaces, Easy Integration
  • Supports CameraLink/USB 3.0/GigE/HDMI/SDI/MIPI/Fiber optic interfaces

  • Flexible RAW/ YUV image output

Specifications

ModelGAVIN GC615HMG HOT MWIR Cooled Infrared Camera Core
Resolution640×512
Pixel Size15μm
Spectral Response3.7μm±0.2μm~4.8μm±0.2μm
IR Detector NETD(23℃)20mK(F4)
Image Processing
Frame Rate50Hz (F4) / 30Hz (F5.5)
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Analog VideoPAL/NTSC
Digital VideoStandard:DVP/LVDS/USB2.0
Option:Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply12V±1V
Steady Power Consumption(23℃)≤7W
Cooling Time(23℃)≤3min30s
Size(mm)71×55×84
Weight(g)≤350
Operating Temperature-40℃~+71℃
Optical Lens
Lens OptionsFixed focus: 25mm/F2
Continuous zoom: 18~275mm/F5.5  90~1100mm/F5.5  15~300mm/F4  23~450mm/F4


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • High Sensitivity

  • Easy Integration

  • Next-generation Image Algorithms

  • High Sensitivity

  • Easy Integration

  • Next-generation Image Algorithms

  • High Sensitivity

  • Exceptional Image Quality

  • Easy Integration


  • LWIR with Resilience Against Interference

  • T2SL

  • Rich Interfaces, Easy Integration


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