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GAVIN GC615LA LWIR 640×512 15μm T2SL Cooled Infrared Camera Core
GAVIN GC615LA LWIR 640×512 15μm T2SL Cooled Infrared Camera Core

GAVIN GC615LA
LWIR 640×512/15μm T2SL Cooled Infrared Camera Core

The GAVIN GC615LA infrared camera core integrates a Type-II Superlattice (T2SL) 640×512/15μm LWIR cooled infrared detector with multiple image processing algorithms. It supports various mainstream video interfaces, making development convenient and integration flexible. This camera core is an ideal solution for long-range, high-performance LWIR electro-optical system integration, particularly suited for precise target detection in challenging environments such as dusty conditions or strong sunlight with reflective interference.

Main Features

Mainstream FPA, Wide Application
Mainstream FPA, Wide Application
  • Developed with a 640×512/15μm LWIR cooled detector for exceptional detail

  • Enhanced with next-generation image algorithms including DRC, 2D/3D noise reduction, and EE edge enhancement for clearer imaging


LWIR with Resilience against Interference
LWIR with Resilience against Interference
  • Strong resistance to dust and glare, adaptable to complex environments

  • Capable of detecting low-temperature objects

  • Type-II Superlattice technology with excellent quantum efficiency and uniformity

Rich Interfaces, Easy Integration
Rich Interfaces, Easy Integration
  • Multiple image interfaces: CameraLink/USB3.0/GigE/HDMI/SDI/MIPI/Fiber

  • Flexible RAW/YUV image data output


Specifications

ModelGAVIN GC615LA LWIR Cooled Infrared Camera Core
Indicators
Resolution640×512
Pixel Size15μm
Spectral Response7.7μm±0.2μm~9.4μm±0.3μm
IR Detector NETD(23℃)25mK(F2)
Image Processing
Frame Rate50Hz/100Hz/200Hz
Dimming ModeLinear/Histogram/Mixed
Digital Zoom1× to 8× continuous digital zoom
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Digital VideoStandard: DVP
Option: Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply24V±4V
Steady Power Consumption(23℃)≤11W
Cooling Time(23℃)≤8min
Size(mm)145×58.5×77
Weight(g)≤650
Operating Temperature-40℃~+71℃
Optical Lens
Lens OptionsFixed focus: 25mm/F2
Continuous zoom: 30~300mm/F2


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • LWIR with Resilience Against Interference

  • T2SL

  • Rich Interfaces, Easy Integration


  • Cutting-edge HOT Technology

  • SWaP Optimization

  • Easy Integration

  • 2.5–4.8μm Spectral Coverage

  • High Sensitivity

  • Easy Integration

  • High Sensitivity

  • Easy Integration

  • Next-generation Image Algorithms

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