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GAVIN GC615MB MWIR 640×512 15μm MCT Cooled Infrared Camera Core
GAVIN GC615MB MWIR 640×512 15μm MCT Cooled Infrared Camera Core

GAVIN GC615MB
MWIR 640×512/15μm MCT Cooled Infrared Camera Core

The GAVIN GC615MB MWIR cooled infrared core integrates a 640×512/15μm MWIR detector with an RS046 low-temperature Stirling cryocooler. It features built-in image processing algorithms and offers a comprehensive range of specifications with excellent consistency, fully meeting the demands of large-scale industrial applications. Even in complete darkness or harsh weather conditions, the camera core delivers clear thermal images and accurate detection of both distant threats and close-range details. Ideal for security, surveillance, and monitoring scenarios, the GAVIN GC615MB infrared camera core provides reliable technological support across diverse environments.

Main Features

Mainstream FPA, Broad Compatibility
Mainstream FPA, Broad Compatibility
  • Powered by a 640×512/15μm mid-wave cooled infrared detector for sharp, detailed thermal imaging

  • Integrates advanced image processing algorithms including DRC, 2D/3D noise reduction, and edge enhancement (EE) for superior clarity


High Reliability, Superior Sensitivity
High Reliability, Superior Sensitivity
  • MWIR cooled thermal imaging technology ensures excellent adaptability and consistency across applications

  • Outstanding thermal sensitivity with NETD ≤ 20mK

Easy Integration, Flexible Configuration
Easy Integration, Flexible Configuration
  • Supports CameraLink interface with RAW/YUV image data output

  • Multiple continuous zoom optical configurations available for different needs

Specifications

ModelGAVIN GC615MB MWIR Cooled Infrared Camera Core
Indicators
Resolution640×512
Pixel Size15μm
Spectral Response3.7μm±0.2μm~4.8μm±0.2μm
IR Detector NETD(23℃)20mK(F4)
25mK(F5.5)
Image Processing
Frame Rate50Hz/100Hz
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Analog VideoPAL/NTSC
Digital VideoStandard:DVP/LVDS/USB2.0@50Hz
Option:Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply24V±4V
Steady Power Consumption(23℃)≤10W
Cooling Time(23℃)≤8min
Size(mm)120×84×60
Weight(g)≤440
Operating Temperature-40℃~+71℃
Optical Lens
Lens OptionsFixed focus: 25mm/F2
Continuous zoom: 15~300mm/F4 23~450mm/F4


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • High Sensitivity

  • Easy Integration

  • Next-generation Image Algorithms

  • 2.5–4.8μm Spectral Coverage

  • High Sensitivity

  • Easy Integration

  • High Sensitivity

  • Exceptional Image Quality

  • Easy Integration


  • Cutting-edge HOT Technology

  • SWaP Optimization

  • Easy Integration

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