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GAVIN GC625LC LWIR 640×512 25μm T2SL Cooled Infrared Camera Core
GAVIN GC625LC LWIR 640×512 25μm T2SL Cooled Infrared Camera Core

GAVIN GC625LC
LWIR 640×512/25μm T2SL Cooled Infrared Camera Core

The GAVIN GC625LC infrared camera core integrates a Type-II Superlattice (T2SL) 640×512/25μm LWIR cooled infrared detector. Compared to traditional 640×512/15μm LWIR camera cores, the larger 25μm pixel size capture more thermal radiation, delivering superior image quality. The camera core incorporates multiple image processing algorithms, making it especially suitable for reconnaissance and detection in challenging environments, such as dusty conditions or strong sunlight with reflective interference. It also supports various mainstream video interfaces, providing easy development and flexible integration, making it an ideal choice for long-range, high-performance LWIR system integration.

Main Features

Mainstream FPA, Larger Pixel Size
Mainstream FPA, Larger Pixel Size
  • Developed with a 640×512/25μm LWIR cooled infrared detector for stable imaging and wide application

  • Enhanced with next-generation image algorithms including DRC, 2D/3D noise reduction, and EE edge enhancement for clearer imaging


LWIR with Resilience against Interference
LWIR with Resilience against Interference
  • Strong resistance to dust and glare, adaptable to complex environments

  • Capable of detecting low-temperature objects

  • Type-II Superlattice technology with excellent quantum efficiency and uniformity


Rich Interfaces, Easy Integration
Rich Interfaces, Easy Integration
  • Multiple image interfaces: CameraLink/USB 3.0/GigE/HDMI/SDI/MIPI/Fiber

  • Flexible RAW/YUV image data output

Specifications

ModelGAVIN GC625LC LWIR Cooled Infrared Camera Core
Indicators
Resolution640×512
Pixel Size25μm
Spectral Response7.7μm±0.2μm~9.4μm±0.3μm
IR Detector NETD(23℃)20mK(F2)
Image Processing
Frame Rate100Hz/200Hz
Dimming ModeLinear/Histogram/Mixed
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Digital VideoStandard: DVP
Option: Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply24V±4V
Steady Power Consumption(23℃)≤18W
Cooling Time(23℃)≤9min
Size(mm)148×59×81
Weight(g)≤730
Operating Temperature-40℃~+71℃
Optical Lens
Lens OptionsFixed focus: 55mm/F2


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • LWIR with Resilience Against Interference

  • T2SL

  • Rich Interfaces, Easy Integration


  • Cutting-edge HOT Technology

  • SWaP Optimization

  • Easy Integration

  • 2.5–4.8μm Spectral Coverage

  • High Sensitivity

  • Easy Integration

  • High Sensitivity

  • Easy Integration

  • Next-generation Image Algorithms

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