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GAVIN GC625MC MWIR 640×512 25μm MCT Cooled Infrared Camera Core
GAVIN GC625MC MWIR 640×512 25μm MCT Cooled Infrared Camera Core

GAVIN GC625MC
MWIR 640×512/25μm MCT Cooled Infrared Camera Core

The GAVIN GC625MC MWIR cooled infrared camera core integrates a 640×512/25μm MWIR detector. With its large 25μm pixel size, it offers a greater infrared radiation sensing area and superior signal-to-noise ratio under the same array format. Equipped with multiple built-in image processing algorithms, it delivers clear infrared images even in total darkness or harsh weather conditions. The detector enables long-range detection and recognition of potential threats, while capturing richer details of close-range targets, meeting customers’ pursuit of high SNR and extended detection range.

Main Features

Mainstream Resolution, Exceptional Image Quality
Mainstream Resolution, Exceptional Image Quality
  • Powered by a 640x512/25μm MWIR cooled infrared detector for stable image quality and broad compatibility

  • Compare with same resolution offerings, the camera core with 25μm large pixel size delivers clearer images and a higher signal-to-noise ratio (SNR)

  • Integrates advanced image processing algorithms including DRC, 2D/3D noise reduction, and edge enhancement (EE) for superior clarity


High Reliability, Superior Sensitivity
High Reliability, Superior Sensitivity
  • MWIR cooled thermal imaging technology ensures excellent adaptability and consistency across applications

  • Outstanding thermal sensitivity with NETD ≤ 10mK


Easy Integration, Flexible Configuration
Easy Integration, Flexible Configuration
  • Supports CameraLink interface with RAW/YUV image data output

  • Multiple continuous zoom optical configurations available for different needs


Specifications

ModelGAVIN GC625MC MWIR Cooled Infrared Camera Core
Indicators
Resolution640x512
Pixel Size25μm
Spectral Response3.7μm±0.2μm~4.8μm±0.2μm
IR Detector NETD(23℃)10mK(F2)
Image Processing
Frame Rate50Hz/100Hz
Digital Zoom1× to 8× continuous digital zoom
Image DirectionHorizontally/Vertically/Diagonally Flip
Image AlgorithmDRC, 2D/3D Image Noise Reduction, EE
Electrical
Analog VideoPAL/NTSC
Digital VideoStandard:DVP/LVDS/USB2.0@50Hz
Option:Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External SyncStandard: LV-TTL
Option: RS422/LVDS
CommunicationStandard: USB2.0/LV-TTL
Option: RS422/CAN/USB3.0/GigE
Power Supply24V±4V
Steady Power Consumption(23℃)≤18W
Cooling Time(23℃)≤9min
Size(mm)148×59×81
Weight(g)≤730
Operating Temperature-40℃~+71℃
Optical Lens
Lens Options40mm/F2


Applications

Learn More >>
Chip Material Research
Chip Material Research
Long Range Monitoring
Long Range Monitoring
Non Destructive Testing
Non Destructive Testing
PCBA Inspection
PCBA Inspection
  • High Sensitivity

  • Easy Integration

  • Next-generation Image Algorithms

  • High Sensitivity

  • Easy Integration

  • Next-generation Image Algorithms

  • 2.5–4.8μm Spectral Coverage

  • High Sensitivity

  • Easy Integration

  • Cutting-edge HOT Technology

  • SWaP Optimization

  • Easy Integration

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