The iMC212 infrared miniature modules is built on the self-developed TIMO212 module, targeting mobile terminal applications. Integrated with an infrared ISP processing board and structural components, it supports direct output of thermal images and temperature matrices without the need for temperature calibration, significantly reducing development effort. The iMC ultra-compact module is a cost-effective and less power-hungry offering. Equipped with universal control interfaces, it simplifies the integration and development process, reducing the technical barrier of integrators to infrared thermal imaging technology.
Equipped with a self-developed wafer-level infrared detector, offering significant cost advantages
Ultra-compact design, ideal for mobile and portable devices
Paired with a ISP Processing Board and Intelligent Image Algorithm to output thermal images and temperature matrices directly
Encased in structural components for enhanced reliability and completeness
Provides standard and widely compatible USB 2.0 digital video output interface
Factory-calibrated temperature data, no need for additional development effort
| Model | iMC212 |
| Resolution | 256×192 |
| Pixel Size | 12μm |
| Spectral Response | 8~14μm |
| NETD | ≤50mK |
| Output Data | 14bit Raw |
| Frame Rate | 25Hz |
| Focus Mode | Focus Free |
| Lens(HFOV/FL) | 56°/ 3.2mm |
| Digital Video Interface | USB2.0 |
| Operating Voltage | 3.3V±0.1V |
| Typical Power Consumption | 300mW |
| Temperature Measurement Range | -20℃~+550℃(-20℃~+150℃ | +100℃~550℃) |
| Temperature Measurement Accuracy | Greater of ±2℃ / ±2% |
| Operating Temperature | -20℃～-60℃ |
| Humidity | 5%~85% |
| Storage Temperature | -45℃~+85℃ |
| Certification | CE, FCC, RoHS |
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