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MICO212 LWIR 256×192 12μm Uncooled Infrared Thermal Core
MICO212 LWIR 256×192 12μm Uncooled Infrared Thermal Core

MICO212
LWIR 256×192/12μm Uncooled Infrared Thermal Core

The MICO212 ultra-compact infrared camera core integrates a 256×192 resolution infrared detector, a 10mm optical lens (FOV: 17.5°×13.2°), an image processing board, and high-strength structural components. It transmits analog or digital video to backend platforms, significantly reducing the integration cycle for customers. Offering a cost-effective thermal imaging solution, it greatly lowers the threshold for infrared integration.

Main Features

Cost-Effective Solution for Low-cost Demand
Cost-Effective Solution for Low-cost Demand
  • Equipped with self-developed 256×192/12μm wafer-level infrared detector, offering a clear cost advantage

  • Integrated with a dedicated ASIC chip for high energy efficiency

Optimized SWaP Design
Optimized SWaP Design
  • Ultra-compact size: only 22.2×22.2×28.4mm (excluding lens)

  • Lightweight: just 16±2g

  • Low power consumption: 550mW

Easy Development & Quick Integration
Easy Development & Quick Integration
  • NProvides native analog or digital video output, supporting CVSB/USB/MIPI standards—no additional development required

  • Easy mounting with minimal structural design effort

Specifications

ModelMICO212
IR Detector
Sensitive MaterialVOx
Resolution256×192
Pixel Size12µm
NETD≤30mK/F1.0/25℃
Spectral Response8~14μm
Optical Lens
Focus/F#10mm/F1.0-FF
FOV17.5°(H)×13.2°(V)
Detection Range
(8 pixels)
99m (5'11” tall person)
360m (4m×3m vehicle)
TypeFixed Focus Athermal:
First lens sealing/coatingIP67/HD
Image Processing
Analog VideoPAL(default) / NTSC
Digital VideoUSB
Start-up Time≤6s
Image AlgorithmNUC/3D/2D/DRC/EE/SFFC
Pseudo Color11 types - customizable
Electrical Interface
Standard External Interface3PIN interface (A1251-WV-S-3P)9PIN interface(A1251-WV-S-9P)
Video InterfaceCVBSUSB
Power Supply
Supply VoltageDC: 5V~24V
Steady Power Consumption≤550mW@5V, 23±3℃
Mechanical
Dimension≤22.2mm×22.2mm×28.4mm (L×W×H)
Weight<16±2g
Environmental Adaptability
Operating Temperature-40℃~+70℃
Storage Temperature-45℃~+85℃
Humidity5%~95%, non-condensing
VibrationRandom Vibration, 5.35grms, 3-axis
ImpactHalf Sine Wave, 40g/11ms, 3 Axis, 6 Direction
CertificationROHS2.0/REACH


Applications

Learn More >>
Bellows Hotspot Detection
Bellows Hotspot Detection
Electrical Cabinet Thermal Scan
Electrical Cabinet Thermal Scan
Molten Iron Temperature Check
Molten Iron Temperature Check
Power Line Fault Detection
Power Line Fault Detection
  • SWaP

  • Cost-Effective

  • Easy Integration

  • 256×192/12μm

  • Ultimate SWaP-C Optimization

  • Wafer-Level Packaging

  • 256×192/12μm

  • Rich Interfaces and Lens Options

  • Wafer-Level Packaging

  • 256×192/12μm

  • Applied to Mobile Terminal Devices

  • Wafer-Level Packaging

Reach Our Experts
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