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MINI212G2 LWIR 256×192 12μm Uncooled Infrared Thermal Module
MINI212G2 LWIR 256×192 12μm Uncooled Infrared Thermal Module

MINI212G2
LWIR 256×192/12μm Uncooled Infrared Thermal Module

The Mini212G2 uncooled infrared miniature module is built on SensorMicro’s self-developed TIMO212 infrared module. The addition of an infrared ISP processing board enables direct output of temperature matrices and thermal images, significantly reducing the development workload for customers. Featuring compact size, low power consumption, and cost efficiency, it supports multiple field-of-view configurations and integrates a universal control interface, enabling broad applicability across industries.

Main Features

Miniature Module with Direct Thermal Imaging Output
Miniature Module with Direct Thermal Imaging Output
  • Equipped with a self-developed 256×192/12μm wafer-level infrared detector, offering significant cost advantages

  • Ultra-compact structural design: only 17×17mm (PCBA) in size, weighing as low as 4g — ideal for space-constrained applications

  • Integrated ISP processing board and next-gen image algorithms deliver clear thermal images directly, ensuring strong versatility


Precise Detection, Flexible Configuration
Precise Detection, Flexible Configuration
  • High-precision temperature measurement with accuracy up to ±2℃; supports spot, area, and full-frame measurement

  • Multiple field-of-view lens options available to meet various observation requirements

Rich Interfaces for Easy Integration
Rich Interfaces for Easy Integration
  • Offers USB2.0 / MIPI / DVP / BT.656 / LVDS and other digital video output interfaces, 

  • Fully compatible with industry-standard interfaces

Specifications

ModelMini212G2
Resolution256×192
Pixel Size12μm
Spectral Response8~14μm
NETD≤50mK
Output Data14bit Raw
Frame RateThermography: 25Hz, Imaging: ≤50Hz
Focus ModeFocus Free
Lens(HFOV/FL)17.5°/10mm25°/ 7mm56°/ 3.2mm90°/ 2.1mm
Weight(g)7.16.446.8
PCBA Size(mm)17×17
Digital Video InterfaceUSB2.0 / MIPI / DVP / BT.656 / LVDS
Analog Video InterfaceCVBS(PAL/NTSC)
Operating Voltage3.3V±0.1V
Typical Power Consumption330mW
Temperature Measurement Range-20℃~+550℃(-20℃~+150℃ | +100℃~550℃)
Temperature Measurement AccuracyGreater of ±2℃ / ±2%
Operating Temperature-40℃~+70℃
Humidity5%~85%
Storage Temperature-45℃~+85℃
CertificationRoHS 2.0 / Reach


Applications

Learn More >>
Bellows Hotspot Detection
Bellows Hotspot Detection
Electrical Cabinet Thermal Scan
Electrical Cabinet Thermal Scan
Molten Iron Temperature Check
Molten Iron Temperature Check
Power Line Fault Detection
Power Line Fault Detection
  • 256×192/12μm

  • Ultimate SWaP-C Optimization

  • Wafer-Level Packaging

  • 256×192/12μm

  • Applied to Mobile Terminal Devices

  • Wafer-Level Packaging

  • 120×90/12μm

  • Ultimate SWaP-C Optimization

  • Integration into Miniature Devices

  • 120×90/12μm

  • Applied to Mobile Terminal Devices

  • Wafer-Level Packaging

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