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TIMO212 LWIR 256×192 12μm Uncooled Infrared Thermal Module
TIMO212 LWIR 256×192 12μm Uncooled Infrared Thermal Module

TIMO212
LWIR 256×192/12μm Uncooled Infrared Thermal Module

The TIMO212 is an uncooled infrared miniature module. It features a self-developed 256×192/12μm wafer-level detector, along with a wafer-level optical lens and micro-electromagnetic valve shutter, enabling precise temperature data and heat distribution capture for specific target areas. The product is engineered to accommodate integration across diverse sectors including mobile terminals, instruments and meters, and the Internet of Things (IoT). It offers exceptional miniaturization and ultra-low power consumption, while supporting multiple field-of-view lens options to meet varying requirements for viewing angles and imaging quality across different application scenarios. Its universal control interface and intelligent power management scheme provide higher integration efficiency and lower overall cost for OEMs, accelerating the deployment of innovative infrared applications.

Main Features

Ultra-Miniature Module with Ultimate SWaP-C Optimization
Ultra-Miniature Module with Ultimate SWaP-C Optimization
  • Wafer-level packaged detector + wafer-level optics + micro-electromagnetic valve shutter

  • The smallest infrared thermal module, enabling basic thermal imaging functionality with maximum cost efficiency

  • Compact size, lightweight, and low power consumption, ideal for integration into miniature devices

Flexible Optic Options, Accurate Temperature Measurement
Flexible Optic Options, Accurate Temperature Measurement
  • Multiple lens options available, including wide-angle and telephoto, to meet diverse application needs

  • High-precision temperature measurement with accuracy up to ±2°C; supports both regional and full-frame temperature monitoring

Easy Integration, Fast Development
Easy Integration, Fast Development
  • Supports DVP image interface, compatible with various embedded platforms

  • Compliant with RoHS 2.0 environmental standards

Specifications

ModelTIMO212
Resolution256×192
Pixel Size12μm
Spectral Response8-14μm
Focus ModeFocus Free
Lens(HFOV/FL)17.5°/ 10mm25°/ 7mm56°/ 3.2mm90°/ 2.1mm
Weight(g)5.1±0.44.4±0.42±0.24.8±0.4
Size (mm, without FPC)16×14×1816×14×14.614×12×9.816×14×15.6
Number of PINs40PIN
Output Data14bit Raw
Frame RateThermography: 25Hz, Imaging: ≤50Hz
Temperature Measurement
Temperature Measurement Range-20℃~+550℃(-20℃~+150℃ | +100℃~550℃)
Temperature Measurement AccuracyGreater of ±2℃ / ±2%
Environmental Adaptability & Certification
Operating Temperature-40℃~+70℃
Humidity5%~85%
Storage Temperature-45℃~+85℃
CertificationRoHS 2.0 / Reach


Applications

Learn More >>
Bellows Hotspot Detection
Bellows Hotspot Detection
Electrical Cabinet Thermal Scan
Electrical Cabinet Thermal Scan
Molten Iron Temperature Check
Molten Iron Temperature Check
Power Line Fault Detection
Power Line Fault Detection
  • 120×90/12μm

  • Ultimate SWaP-C Optimization

  • Integration into Miniature Devices

  • 120×90/12μm

  • Applied to Mobile Terminal Devices

  • Wafer-Level Packaging

  • 256×192/12μm

  • Rich Interfaces and Lens Options

  • Wafer-Level Packaging

  • 256×192/12μm

  • Applied to Mobile Terminal Devices

  • Wafer-Level Packaging

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