ApexCore is more than a product upgrade—it is a full-platform evolution of uncooled infrared detector technology.
Developed from years of innovation across readout circuits (ROIC), MEMS microstructure engineering, advanced materials, packaging, and mass production processes, ApexCore sets the pace in uncooled infrared detectors through high sensitivity and exceptional image clarity, redefining what “peak performance” means in thermal imaging.
ApexCore’s “peak” capability is driven by four key technological innovations:
1. Advanced ROIC + VOx Material System
ApexCore combines a VOx-based thermosensitive material system with an innovative readout circuit (ROIC) architecture. This co-optimization at both material and circuit levels significantly enhances responsivity and signal processing capability.
The result is a 42% reduction in overall system noise, establishing a new baseline for image quality and enabling clearer, more detailed thermal visualization.
2. Reinforced MEMS Architecture: Vespira
At the structural level, ApexCore introduces Vespira, a reinforced MEMS micro-bridge architecture engineered for high-reliability environments.
This enhanced design enables the detector to meet stringent automotive standards, including AEC-Q100 Grade 2 reliability requirements. It has been validated through rigorous testing such as:
85°C / 85% RH for 1000 hours
125°C high-temperature storage for 1000 hours
-55°C to 125°C thermal cycling (1000 cycles)
1500g / 0.5ms mechanical shock
These certifications ensure dependable performance under extreme conditions such as:
High temperature and humidity
Continuous vibration
Mechanical stress
These make ApexCore particularly well-suited for demanding applications, including automotive and industrial systems.
3. SensorMicro Gen-4 Packaging Technology
ApexCore fully adopts SensorMicro Gen-4 advanced packaging technology, a next-generation solution that replaces traditional wafer-level packaging.
Key advantages include:
No need for additional dust-proof windows, simplifying system integration
Reduced dependency on cleanroom conditions during assembly
Compact, lightweight form factor for modern device design
Improved mechanical robustness and environmental adaptability
This innovation addresses long-standing industry challenges related to contamination sensitivity and integration complexity.
4. Optimized MEMS Fabrication for Consistency
ApexCore features continuous optimization of critical MEMS fabrication processes, significantly improving both intra-batch and inter-batch consistency.
For system manufacturers, this translates into:
Easier calibration
Shorter development cycles
Higher production yield
More reliable large-scale deployment
Consistency is no longer a bottleneck—it becomes a competitive advantage.
ApexCore is engineered to deliver measurable performance gains:
sNETD as low as 15mK for detecting extremely subtle temperature differences
Smoother image gradients and enhanced scene detail
Significantly improved signal-to-noise ratio
Elimination of common image artifacts such as haze
These improvements enable ultra-clear thermal imaging across a wide range of applications.
With lower noise, stronger structure, smarter packaging, and greater consistency, ApexCore delivers a new standard in uncooled infrared detection.
ApexCore — At the Peak. Into the Future.
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