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SensorMicro Launches a Complete Portfolio of HOT Cooled Infrared Components

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    SensorMicro has officially launched its full range of HOT (High Operating Temperature) cooled infrared components, expanding its portfolio with broader specifications and more options for high-end infrared applications.

    HOT infrared devices are widely recognized in the industry as an ideal SWaP (Size, Weight, and Power) optimization solution. Backed by years of expertise in Type-II superlattice technology, SensorMicro now delivers a complete lineup of HOT cooled infrared components, all ready for stable, high-volume production and delivery.

     

    More Than One Option: Advanced HOT Technology Meets Diverse Configurations

    Built on advanced superlattice material technology, SensorMicro’s HOT cooled IR detectors enable focal plane arrays to operate at temperatures up to 160K, significantly reducing the cooling burden required for noise suppression. This breakthrough translates into substantial improvements in cooling time, size, weight and power consumption. 

    The HOT series covers a comprehensive range of resolutions covering from the most common 640×512 to ultra-large 2560×2048, with pixel size as small as 7.5μm.

    Whether for long-range surveillance or wide-area, high-precision detection, the HOT series detector delivers a wider field of view and richer image detail across diverse application scenarios. It provides a powerful and flexible thermal imaging solution for mid-to-high-end electro-optical systems.




    More Than Detectors: A Complete Product Ecosystem

    Beyond detectors, SensorMicro has developed a full product ecosystem around its HOT technology, extending from core sensing components to fully integrated solutions.

    HOT Infrared Module Solution

    |Accelerate Development, Simplify Integration

    Designed with the same form factor as cooled infrared detectors, HOT modules allow OEM customers to quickly evaluate and validate detector performance.

    This significantly simplifies system integration and shortens overall development cycles.


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    HOT Infrared Camera Core Solution

    |High Integration, Faster Time-to-Market

    Building on the module platform, the HOT infrared camera core further integrates optical components, electronic circuits, and advanced image processing algorithms into a compact unit. With support for multiple lens configurations, standard industry interfaces, and multi-platform communication protocols, it enables fast and flexible integration into a wide range of end-user devices.



     

    More than Compactness: SWaP³ Optimization for Lighter, More Flexible Systems

    SensorMicro’s HOT series is engineered with a strong focus on SWaP³ optimization, overcoming the traditional limitations of bulky cooled infrared systems.By simultaneously reducing size, weight, power consumption, and overall cost, the series achieves a more compact and efficient design without compromising imaging performance.


     


    The upgraded lightweight design allows easy integration into portable and mobile platforms, overcoming space constraints and redefining the boundaries of cooled infrared system design.


     


    From core technology to system-level solutions, SensorMicro’s HOT full-series products demonstrate strong integration advantages across the infrared thermal imaging industry.

    Leveraging the technological strength and manufacturing scale of its parent group GUIDE INFRARED, SensorMicro will continue to push the boundaries of infrared innovation, delivering more advanced, efficient, and application-ready solutions for next-generation high-end electro-optical systems.


    References
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    • Designed for CO Leak

    • High Sensitivity

    • Rich Interfaces, Easy Integration

    • 1280×1024/10μm

    • LWIR

    • Easy Integration

    • Cutting-edge HOT Technology

    • Easy Integration

    • Large Format, Small Pixel

    • 120×90/12μm

    • Applied to Mobile Terminal Devices

    • Wafer-Level Packaging

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