SensorMicro Showcases Advanced Thermal Imaging Solutions for the Low-Altitude Economy at UASE 2026

ApexCore Detectors and Ultra-Compact Thermal Cores Demonstrate New Possibilities for Intelligent Airborne and Mobile Platforms

SHENZHEN, China — 21th May 2026 — SensorMicro participated in the International Low-Altitude Economy and Unmanned Systems Expo 2026 (UASE 2026) for the first time, presenting its latest infrared detector technologies and thermal imaging solutions designed for intelligent airborne systems, mobile platforms, and emerging low-altitude economy applications.

Recognized as one of the industry's most influential annual events, UASE 2026 brought together technology developers, system manufacturers, and solution providers from across the global low-altitude ecosystem. The exhibition served as a platform for exploring new opportunities in aerial mobility, intelligent sensing, and autonomous systems while highlighting the technologies shaping the future of flight and airborne perception.

As an innovator in infrared imaging technology, SensorMicro joined the exhibition alongside its sister company to showcase a comprehensive portfolio of thermal imaging solutions. Through product demonstrations and technical discussions, the company engaged with industry partners on the evolving requirements of low-altitude applications and the growing demand for lightweight, high-performance sensing technologies.

ApexCore Detector Family Raises the Standard for Thermal Imaging Performance

Among the highlights at the exhibition was the ApexCore detector family, SensorMicro's next-generation infrared detector platform.

Built on a newly developed material system and MEMS architecture, ApexCore achieves a system sensitivity (sNETD) as low as 15 mK, enabling thermal imaging systems to detect subtle temperature differences with exceptional precision. Whether observing distant targets or operating in complex environments with limited thermal contrast, ApexCore delivers sharper image detail, enhanced scene separation, and improved target recognition capability.

The enhanced sensitivity of ApexCore allows thermal imaging systems to reveal finer thermal structures and more natural image depth, providing users with a clearer and more informative view of their surroundings.

8μm Thermal Cores Drive the Next Wave of Payload Miniaturization

SensorMicro also showcased its latest 8μm thermal imaging core portfolio, including the flagship iTL1208 and iTL608.

As one of the industry's pioneering megapixel uncooled thermal imaging cores, the iTL1208 combines a 1280 × 1024 /8μm detector with an exceptionally compact 22.6 × 22.6 mm form factor. While delivering four times the pixel count of conventional 640 × 512 solutions, the module maintains a remarkably small footprint, demonstrating that high-definition thermal imaging and lightweight integration no longer need to be competing design goals.

The iTL608 further illustrates the advantages of advanced 8μm pixel technology. By significantly reducing detector size while maintaining high imaging performance, the module achieves an ultra-compact 13 × 13 mm footprint. The reduced size and weight help system manufacturers optimize payload efficiency while extending operational endurance on mobile and airborne platforms.

12μm Thermal Core Solutions Expand Options for Mobile Detection Applications

The company's 12μm thermal imaging core lineup attracted strong interest from visitors seeking compact solutions for mobile sensing applications.

The iSE1212 features a shutterless design that enables smooth, uninterrupted imaging while supporting demanding long-range observation and temperature measurement tasks. Its performance characteristics make it well suited for public safety, emergency response, infrastructure inspection, and security monitoring applications.

SensorMicro also exhibited the iTL612 Series IR camera cores, which measures only 17.3 × 17.3 × 23.4 mm and weighs 13 g including a 9.1 mm lens. Available in both imaging and thermography configurations, the series supports multiple SDK options to simplify integration into compact systems.

Alongside the iTL612 Series, the MICO Series demonstrated how ready-to-integrate thermal modules can help developers accelerate product deployment while minimizing integration complexity.

Miniature Thermal Modules Simplify Consumer Device Integration

As thermal imaging continues to expand into consumer and smart-device markets, demand for smaller and easier-to-integrate thermal modules is increasing rapidly.

To address this trend, SensorMicro presented its Mini and iMC product families.

The Mini Series infrared module enables rapid integration by providing both thermal imagery and temperature matrix output with minimal development effort. The iMC Series infrared plug-in can be connected directly to mobile devices, making it easier for manufacturers to incorporate thermal imaging capabilities into applications such as home inspection, smart appliances, and portable diagnostic tools.

Supporting the Growth of the Low-Altitude Economy

Although UASE 2026 marked SensorMicro's first participation in the exhibition, the company's thermal imaging technologies have already been widely deployed across a variety of intelligent airborne systems and autonomous platforms operating in inspection, public safety, industrial monitoring, and other specialized applications.

As the low-altitude economy continues to evolve, thermal imaging is expected to play an increasingly important role in enabling safer operations, improved situational awareness, and more reliable sensing capabilities.

SensorMicro will continue advancing infrared detector technology, compact thermal imaging architectures, and efficient integration solutions. Through ongoing innovation in miniaturization, power efficiency, and imaging performance, the company aims to help accelerate the development of intelligent sensing systems for a growing range of mobile applications.