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SensorMicro to Showcase Advanced Cooled Infrared Technologies at CIOE 2026

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    Three Core Innovations Set to Take Center Stage at China International Optoelectronic Expo


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    From September 9 to 11, SensorMicro will showcase its latest cooled infrared technologies at the China International Optoelectronic Exposition (CIOE 2026) in Shenzhen. As one of the largest optoelectronics events in the industry, CIOE 2026 is expected to bring together more than 4,000 exhibitors and 150,000 professional visitors from around the world.


    At this year's show, SensorMicro will put the spotlight on three technologies designed to address some of the most demanding challenges in infrared imaging: dual-band detection, digital output, and advanced HOT technology.


    Dual-Band Infrared Detection

    Infrared targets do not always present a clear thermal signature. Background radiation, environmental conditions, and other sources of interference can make it difficult for conventional single-band infrared systems to distinguish a real target from its surroundings.


    SensorMicro's dual-band infrared technology takes a different approach by capturing infrared radiation across two spectral bands. By combining information from different wavelength ranges, the system can obtain richer spectral information and improve target discrimination in complex environments.


    The result is a more complete view of the scene, helping users identify meaningful targets while reducing the impact of background interference. For applications where reliable target recognition matters, dual-band detection provides an additional layer of information that conventional single-band imaging cannot offer.


    Digital Output of Thermal Data

    Image quality is not determined by the detector alone. Signal transmission and system architecture also have a direct impact on the final thermal image.


    Traditional analog signal paths can introduce additional interference and place greater demands on downstream circuit design. SensorMicro's digital infrared solutions are designed to output digital signals directly, reducing unnecessary signal conversion and simplifying system integration.


    With a more streamlined signal path, developers can build compact thermal imaging systems with cleaner image output and more stable signal transmission. This approach is particularly valuable for OEMs looking to integrate cooled infrared technology into increasingly compact and sophisticated products.


    Advanced HOT IR Technology

    Cooling is one of the defining challenges of high-performance infrared imaging. Conventional cooled detectors often require the focal plane to operate at very low temperatures, which can increase the size, power consumption, and complexity of the associated cooling system.


    SensorMicro's advanced HOT technology is designed to raise the operating temperature of the infrared focal plane while maintaining high detection performance.


    A higher operating temperature can reduce the cooling burden and open the door to smaller and lower-power cryogenic systems. For system designers, this means more flexibility in achieving a better balance between performance, size, weight, and power consumption.


    By pushing the limits of HOT infrared technology, SensorMicro is working to make high-performance cooled infrared imaging more compact and easier to integrate into demanding applications.


    Discover SensorMicro Cooled IR Innovations at CIOE 2026

    Dual-band detection.
    Digital output.
    Advanced HOT technology.


    At CIOE 2026, visitors will have the opportunity to explore SensorMicro's latest cooled infrared technologies and see how these innovations can support next-generation thermal imaging systems.


    Come to the SensorMicro booth and take a closer look at what is happening inside the infrared core.

     

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    CIOE 2026
    September 9–11, 2026
    Shenzhen World Exhibition & Convention Center, China


    Visit SensorMicro at CIOE 2026 and discover what advanced infrared technology can bring to your next application.


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    References
    • Multi-Gas Leak Detection

    • Advanced HOT Technology

    • SWaP³

    • Wafer-Level Packaging

    • SWaP³

    • Cost-Effective Integration

    • High Sensitivity

    • Exceptional Image Quality

    • Easy Integration


    • High Detection Sensitivity, Typical NETD < 30mK

    • Energy Efficient:<180mW

    • Lightweight Structure


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